To meet the demand of consumers for a richer and more immersive audio experience, mobile phones and tablets need to integrate more complex audio systems, which puts higher demands on the audio performance, low power consumption performance, and space saving of smart audio amplifiers. Recently, Huiding Technology officially launched a new generation of intelligent audio amplifier TFA9865. With its self-developed new pure digital architecture and advanced technology, the chip achieves higher efficiency, greater loudness, and lower noise audio performance, while also having a smaller size, helping terminal manufacturers push audio innovation to a new industry benchmark.

TrendForce Consulting provides updates on the dynamics of semiconductor factories after the 403 earthquake. Due to the fact that most of the wafer foundries in this earthquake are located in areas with a seismic intensity of four, coupled with the fact that semiconductor factories in Taiwan are mostly built with high specifications, the internal shock absorption measures are at the world’s top level, and most of them can reduce vibrations by one to two levels. Based on the seismic intensity of this incident, almost all of them were quickly resumed after shutdown inspection. Even if there were damages to the furnace tubes due to emergency shutdown or earthquakes, resulting in online wafer fragmentation or scrapping, due to the average production capacity utilization rate of mature process plants currently being 50-80%, the significant loss can be quickly replenished after resumption of work, and the impact of production capacity loss is considered minor.

With the widespread application of technologies such as wide bandgap semiconductors with low switching losses, designers have begun to increase the operating frequency of power converters and continuously refresh the power density. However, as the switching frequency increases, the energy loss of traditional planar diodes (including silicon Schottky devices) used as rectifiers also increases, severely limiting the improvement of conversion energy efficiency.

Diodes has released SDT2U30CP3 (30V/2A), SDT2U40CP3 (40V/2A), and SDT2U60CP3 (60V/2A) Schottky rectifiers, which achieve extremely high current density in the industry among their peers. With low forward voltage drop and thermal resistance, they have overcome design challenges for smaller and more efficient portable, mobile, and wearable devices. This series of innovative high current trench Schottky rectifiers uses only 0.84mm ² Chip level packaging (CSP) in circuit board space, suitable for various applications, can be used as a resistive or reverse polarity protection diode, boost diode, and switch diode.