Infineon Technologies has made significant progress in the development of capacitive microelectromechanical ultrasonic sensors (CMUT) technology. With this technology, the company has launched its first highly integrated single-chip solution based on microelectromechanical systems (MEMS) ultrasonic sensors. This solution has a smaller footprint and stronger performance and functionality, and can be widely used to develop new ultrasonic applications and improve existing applications in the fields of consumer electronics, automotive industry, and medical technology.

Recently, Vishay Technology announced the launch of a series of new multi turn surface mount metal ceramic micro adjustment potentiometers - TSM3. The TSM3 series devices are designed for industrial, consumer, and communication applications with limited space in harsh environments. They come in a compact size of 3 mm x 4 mm x 4 mm, with a temperature range of -65 ° C to+150 ° C and a sealing rating of IP67.

Recently, Infineon Technologies announced the establishment of a new business unit that will merge its existing sensor and radio frequency (RF) businesses into a dedicated organization to drive the company’s development in the sensor field. The new business unit SURF (Sensor Unit and Radio Frequency) will become part of the Power Supply and Sensor Systems (PSS) department and include the previous automotive and multi market sensing and control businesses.

Ralf Koedel, Vice President of Automotive MCU at Infineon Technologies, said: ’If we use TRAVEO that complies with ISO/SAE 21434 standards ™ The workload for T2G automotive MCUs and OEMs to meet the requirements of UN ECE R155 and R156 regulations will be significantly reduced, allowing them to enter regulated markets faster. The compliance work of existing customers will become simpler, faster, and more economical, and they can also reuse existing software and hardware. New customers can also benefit from meeting the ISO/SAE 21434 standard