Nexperia has released a series of new logic ICs using the micro car grade MicroPak XSON5 pinless package. These miniature logic ICs are designed for space limited applications and are suitable for various complex application scenarios in the automotive field, such as chassis safety systems, battery monitoring, infotainment systems, and advanced driver assistance systems (ADAS). The MicroPak XSON5 adopts a heat enhanced plastic housing, which reduces the PCB area by 75% compared to traditional pin based micro logic packaging. In addition, the package also features side wettable solder pads that support automatic optical inspection (AOI) of solder joints.

Infineon Technologies launches EiceDriver for IGBT, SiC, and GaN gate driver power supplies ™ Power 2EP1xxR Full bridge transformer driver series. The 2EP1xxR series expands Infineon’s power device product lineup, providing designers with isolated gate driver power solutions. This series of semiconductor devices can help achieve asymmetric output voltage and power isolated gate drivers in an economically efficient and space saving manner.

The AC-50 multi-point press handle driver newly launched by Sosco adopts a dual cable handle design, significantly improving the positioning freedom on large door panels. This design not only facilitates user operation, but also ensures safe and stable multi-point locking, meeting the requirements of ergonomics.

STMicroelectronics has launched an industrial standard and device alarm actuator reference design based on IO Link, with the final delivery form being ready to use finished boards, supporting protocol stacks, and application software.