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Amazon Cloud Technology launches a new generation of self-developed chips
2023-12-04
Amazon Cloud Technology announced at the 2023 re: Invent Global Conference that two series of its self-developed chip family have launched new generations, including Amazon Graviton4 and Amazon Traineum2, providing higher cost-effectiveness and energy efficiency for a wide range of workloads such as machine learning (ML) training and generative artificial intelligence (AI) applications. Graviton4 and Traineum2 are the latest innovations in Amazon Cloud Technology’s self-developed chips. Amazon Cloud Technology continuously improves cost-effectiveness and energy efficiency with each generation of self-developed chips, providing customers with more choices beyond the latest chip and instance combinations based on AMD, Intel, Nvidia, and others, thus enabling Amazon Elastic
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Pickering can switch up to 1kV for a new type of high-voltage SMD reed relay
2023-12-02
The isolation voltage of this series of relays can reach up to 3kV

Pickering Electronics, a leading manufacturer of high-performance tongue spring relays, announced the launch of the first high-voltage surface mount tongue spring relay, known as the 219 series. This series of tongue spring relays come in various packaging forms (with the same size but different pin positions). You can choose from 1 Form A (SPST), 2 Form A (DPST), or 1 Form B (SPNC) contact configurations. Can switch voltage up to 1000V; The isolation voltage of the switch can reach up to 3000V, while the isolation voltage of the switch coil can reach up to 5000V.
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Infineon launches an ultra-low power microcontroller with a PSoC 4000T, which increases signal-to-noise ratio by 10 times and supports multiple sensin
2023-11-27
Infineon Technologies Co., Ltd. recently announced the launch of PSoC ™ 4000T series microcontroller (MCU). This new MCU series achieves the best low-power capacitive sensing solution in its class with excellent signal-to-noise ratio, waterproof characteristics, multiple sensing functions, as well as the highest reliability and robustness.
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Kongat Launches a New Ultra Rugged Computer Module Based on the 13th Generation Intel Core with Surface Mount Memory
2023-11-20
Specially designed for harsh environments, it has excellent shock resistance and shock resistance 2023/11/20 Shanghai, China * * * The leading supplier of embedded and edge computing technology, Kongit, Germany, launched six ultra rugged COM Express compact computer modules based on the 13th generation Intel Core processor. According to design requirements, these six products can withstand extreme temperatures ranging from -40 ° C to+85 ° C. The new COM Express Type 6 computer module comes with surface mount memory, which has excellent seismic and impact resistance, and can work normally in harsh environments, fully meeting the highest standards in the field of railway transportation. These six newly launched computer module products are based on the code name Rapt
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