TDK Corporation (Tokyo Stock Exchange code: 6762) introduced two new copper inner electrode piezoelectric actuators COM30S5 and COM45S5, which are made of Lead zirconate titanate (PZT) materials that meet RoHS requirements. The new components adopt TDK patented copper electrode based HAS (High Efficiency Stacking) technology, which is supplied as passive components in a shell free package, achieving good dynamic range, high force/volume ratio, and nanoscale accuracy. Compared to other technologies, TDK uses HAS technology for piezoelectric actuators with better performance, better humidity stability, and longer service life.

Recently, Shenzhen Xingweifan Electronic Technology Co., Ltd. (hereinafter referred to as "Xingweifan Electronics") took the lead in launching the world’s smallest packaging, high-precision RTC chip SD8565 embedded in the crystal oscillator.

The enclosed fuse holder is fine and excellent: the fuse can be properly protected and easily replaced. According to IEC-60127-6 standard, the previous limit was 16A. Thanks to the standard extension initiated by Shuote, such limitations have become history. The new FXP fuse holder is designed for 6.3x32 fuses with a maximum rated current of 25A (IEC standard) or 45A (UL standard).

STHV200 STHV200 ultrasonic IC of STHV200 is a monolithic integrated linear driver, pulse driver and clamping circuit, switch and diagnostic circuit, which simplifies the design of medical and industrial scanners, reduces the size and reduces the cost of materials.