Nexperia, a high-capacity production expert in the field of basic semiconductor devices, announced the expansion of the NextPower 80/100 V MOSFET product portfolio’s packaging series. Previously, this product combination only provided LFPAK56E packaging, but now it has added LFPAK56 and LFPAK88 packaging designs. These devices have high efficiency and low peak characteristics, suitable for communication, server, industrial, switching power supply, fast charging, USB-PD, and motor control applications.

Melexis, a global microelectronics engineering company, announced today that Melexis has expanded its product range and further consolidated its position in the field of time of flight (ToF) technology. The latest MLX75027RTI helps automotive and industrial customers meet Functional safety requirements.

Last week, we shared and introduced the Yuexin Micro AMP83 series gauge pressure sensors. Their superior zero output, linearity, pressure hysteresis, temperature adaptability, and other indicators have been recognized by many industry customers.

In the field of PCB connectors, screws, springs, and crimping are the most commonly used connection methods. Among them, crimping has been widely used in the industrial field due to its advantages of more reliable connection, excellent seismic performance, and suitability for fully automated wire harness preprocessing. Especially in the automotive industry, almost all of its connectors are connected by crimping.