Infineon Technology Co., Ltd. launches the TLE988x and TLE989x series, further expanding its comprehensive and mature MOTIX ™ MCU embedded power IC product portfolio. Infineon’s system level chip solution integrates gate drivers, microcontrollers, communication interfaces, and power supplies onto one chip, achieving the minimum board area. The all-new TLE988x and TLE989x series have higher performance, characterized by CAN (FD) as the communication interface. The new IC has been certified by AEC Q-100 and is the ideal choice for automotive brushless DC motors and brushless DC motor control applications in body, comfort, and thermal management applications.

Recently, the media learned from the Anhui Provincial Key Laboratory of Quantum Computing Chips that China’s scientific research team has successfully developed the first generation of commercial grade semiconductor quantum chip circuit boards, which can support the packaging and testing needs of up to 6 bit semiconductor quantum chips, enabling semiconductor quantum chips to interact and connect with other key core components of quantum computers more efficiently, fully leveraging the powerful performance of semiconductor quantum chips.

Linghua Technology, the world’s leading edge computing solution provider and NVIDIA’s preferred partner, today released a highly innovative and highly anticipated ROSube RQX-59 series of products, specifically tailored for innovation in the fields of robots, AMR (autonomous mobile robots) and automatic driving.

Today, Samsung Electronics announced that it has started mass production of a new in car UFS 3.1 memory solution optimized for in car infotainment systems (IVI). This solution has the lowest power consumption of Samsung in car memory, which can help car manufacturers create an excellent travel experience for consumers.